Thermal Design & Analysis
SpaceTech personnel expertise covers all thermal engineering processes needed for the development of space products. This includes all necessary tasks from the definition of the thermal environment, over design, analysis up to verification tests.
SpaceTech performs thermo-mechanical stability analysis which combines the structural and thermal analysis capabilities to ensure highly-stable components like the opitcal bench applications, SEH-R and TMA (Triple-Mirror-Assembly for GRACE-Follow-On) retro-reflectors.
- Conceptual idea to detailed analysis
- Analysis to test conduction and test correlation
- Bread board to flight model testing
Thermal engineering support
An example: A two-stage radiator for instrument cooling was developed by STI in 2010. The design includes 2 thermally high-conductive cold-fingers to the optics detectors and a thermally insulated framework for the structural connectivity to the satellite bus. From customer specifications including maximum weight, stiffness, detector temperatures and interface positions a first concept was proposed. After customer approval a detailed design was developed and components like the cold fingers were tested in breadboard designs.
|Radiator concept||Cold-finger bread board design|
Tools for thermal analysis
- ESATAN TMS r4
- SPADES (STI development) integrated thermal module